Resins for heat sink
EP-4101 features:
EP-4101 is high performance heat sink resin, Tg 170℃, good thermal performance (solder duration 10min, Td>380℃), fill up to 75% fillers (according to heat sink, fillers can be alumina, boron nitride, aluminum nitride, etc. ), excellent thermal conductivity and peel strength (>1.8N/mm).
The main application areas of PI-4101 Laminate: LED heat sink laminate
EP-4101 is main component of epoxy resin:
Solid content (230℃×30min) 68.5%--------71.5% EEW 240--320 Viscosity <300CPS |
EP-4101 laminates properties:
Test Item | Treatment Condition | Unit | Property Data | ||
SPEC | Typical Value | ||||
Tg | DSC | ℃ |
| 176 | |
Flammability | C-48/23/50 | / | V-0 | V-0 | |
E-24/125 | |||||
Dielectric Constant(1MHz) | C-24/23/50 | / |
| 5.1 | |
Dissipation Factor(1MHz) | C-24/23/50 | / |
| 0.010 | |
Thermal Stress | Unetched | 288℃，solder dip | / | ＞10s No delamination | 300S No delamination |
Etched | |||||
Peel Stress | Loz Cu. Foil | 288℃，10s | N/mm | ≥1.05 | 1.8 |
125℃ | ≥0.70 | 1.6 | |||
Td | 10℃/min, N2,5%WT Loss | ℃ |
| 380 | |