Low Dk resins
EP-2101 features: EP-2101 is high Tg (220℃), low Dk, low CTE, EP-2101 Laminate is lead-free, UV Blocking and AOI compatible.
The main application areas of PI-3101 substrates: High frequency device, module, Terminal Server, High-speed circuit, Computer.
EP-2101 is mainly composed of epoxy resin:
Solid content 68.5---71.5% |
Viscosity 1000---3000CPS |
PP features (7610 Glass fabric)：
Test Item | Units | Value |
Resin content | ％ | 40---48 |
PG | s | 80-120 |
Resin flow | ％ | 20-30 |
Volatile content | ％ | 0.1-0.30 |
EP-2101 Tg
EP-2101 Dk Df
Frequency | Dk
| Df |
250MHZ | 3.8 | 0.009 |
1.0GHZ | 3.8 | 0.009 |
2.0GHZ | 3.8 | 0.009 |
10GMZ | 3.7 | 0.010 |
EP-2101 Laminates properties:
Test Item | Treatment Condition | Unit | Property Data | ||
SPEC | Typical Value | ||||
Tg | TMA | ℃ | ≥200 | 220 | |
Flammability | C-48/23/50 | / | V-0 | V-0 | |
E-24/125 | |||||
Dielectric Constant(1MHz) | C-24/23/50 | / | ≤5.4 | 3.7 | |
Dissipation Factor(1MHz) | C-24/23/50 | / | ≤0.035 | 0.009 | |
Thermal Stress | Unetched | 288℃,solder dip | / | ＞10s No delamination | 200s No delamination |
Etched | |||||
Peel Strength | 1oz Cu.Foil | 288℃,10s | N/mm | ≥1.05 | 1.5 |
125℃ | ≥0.70 | 1.4 | |||
Flexural Strength | LW | A | Mpa | ≥415 | 560 |
CW | ≥345 | 450 | |||
Water Absorption | D-24/23 | % | ≤0.5 | 0.1 | |
CTE z-axis | Before Tg | TMA | PPM/℃ | ≤60 | 38 |
After Tg | PPM/℃ | ≤300 | 190 | ||
50-260℃ | % | ≤4.0 | 2.3 | ||
Td | 10℃/min,N2,5%WT Loss | ℃ | ≥310 | 350 | |
T260 | TMA | Min | ≥30 | 60 | |
T288 | TMA | Min | ≥5 | 30 | |