Polyimide resins
PI-3101 features:
PI-3101 is Polyimide resin with high Tg (250℃) and low CTE, PI-3101 substrates offer excellent heat resistance in absence of lead.
The main application areas of PI-3101 substrates:
High heat-resistant equipment, aerospace, military industrial.
PI-3101 is mainly composed of polyimide resin
Solid content 58.5—61.5％ |
Viscosity 100—400CPS |
PP features (7628 Glass fabric)：
Test Item | UNITS | VALUE |
Resin content | ％ | 40---48 |
PG（185℃） | S | 50-70 |
Resin flow | ％ | 20-30 |
Volatile content | ％ | 0.1-0.4 |
PI-3101 Tg
PI-3101 excellent heat resistance:
Tg>250℃, Td>380℃
PI-3101 substrates properties:
Test Item | Treatment Condition | Unit | Property Data | ||
SPEC | Typical Value | ||||
Tg | TMA | ℃ | ≥200 | 250 | |
Flammability | C-48/23/50 | / |
| V-1 | |
E-24/125 | |||||
Dielectric Constant(1MHz) | C-24/23/50 | / | ≤5.4 | 4.3 | |
Dissipation Factor(1MHz) | C-24/23/50 | / | ≤0.035 | 0.01 | |
Thermal Stress | Unetched | 288℃,solder dip | / | ＞60s No delamination | 300s No delamination |
Etched | |||||
Peel Strength | 1oz Cu.Foil | 288℃,10s | N/mm | ≥1.05 | 1.6 |
125℃ | ≥0.70 | 1.5 | |||
Flexural Strength | LW | A | Mpa | ≥415 | 600 |
CW | ≥345 | 500 | |||
Water Absorption | D-24/23 | % | ≤0.5 | 0.15 | |
CTE z-axis | Before Tg | TMA | PPM/℃ | ≤60 | 40 |
After Tg | PPM/℃ | ≤300 | 200 | ||
50-260℃ | % | ≤4.0 | 1.8 | ||
Td | 10℃/min,N2,5%WT Loss | ℃ | ≥310 | 380 | |
T260 | TMA | Min | ≥30 | 60 | |
T288 | TMA | Min | ≥5 | 30 | |