Polyimide resins
PI-3103 is Polyimide resin with no-flow, high Tg (250℃), low CTE and excellent heat resistance (Td>370℃).
The main application areas of PI-3101 substrates: connection of performance F/R PWB
PI-3103 is mainly composed of polyimide resin:
Solid content (230℃×30min) 58.5%--------61.5% Viscosity <300CPS |
PP features (1080 Glass fabric)：
Test Item | Units | Value |
Resin content | ％ | 58---62 |
PG | s | 25-30 |
Volatile content | ％ | 0.1-0.3 |
PI-3103 substrates properties:
Test Item | Treatment Condition | Unit | Property Data | |||
SPEC | Typical Value | |||||
Tg | DSC | ℃ |
| 200 | ||
Flammability | C-48/23/50 | / |
| V-1 | ||
E-24/125 | ||||||
Dielectric Constant(1MHz) | C-24/23/50 | / |
| 4.4 | ||
Dissipation Factor(1MHz) | C-24/23/50 | / |
| 0.015 | ||
Thermal Stress | Unetched | 288℃，solder dip | / | ＞10s No delamination | 150S No delamination | |
Etched | ||||||
Peel Stress | Loz Cu. Foil | 288℃，10s | N/mm | ≥1.05 | 1.7 | |
125℃ | ≥0.70 | 1.5 | ||||
Water Absorption | D-24/23 | % | ≤0.5 | 0.16 | ||
CTE z-axis | Before Tg | 50 | PPM/℃ |
| 50 | |
After Tg | PPM/℃ |
| 200 | |||
50-260℃ | % |
| 2.5 | |||
Td | 10℃/min, N2,5%WT Loss | ℃ |
| 370 | ||
PI-3103 forming conditions：
PI-3103Tg：
