ORE-0700	-High Tg -Good heat resistance -Dimensional stability -Nitrogen content: 6.5%
ORE-0701	-Good flexibility -Good heat resistance -High peeling strength -Excellent dimensional stability

Phenolic modified resins

-Insulation
-To increase
hardness
-Auxiliary flame
retardant

ORE-0600	-High Tg -Heat resistance -High peeling strength -Nitrogen content: 14%
ORE-0601	-Good flexibility -Nitrogen content:12% -Good heat resistance -High peeling strength
ORE-0603	-High Tg -Nitrogen content:19% -Good flame retardant -High peeling strength -Excellent heat resistance

Phosphorous epoxy resins

-High Tg
-Heat resistance
-Inflaming retarding

ORE-0301	-Tg >150℃ -High peeling strength -Good heat resistance -Phosphorus content: 2.5%
ORE-0302	-High Tg -Heat resistance -High peeling strength -Phosphorus content: 3.0%
ORE-0303	-Tg >150℃ -High peeling strength -Good heat resistance -Phosphorus content: 4.0%

Low Dk resins

-High peeling strength

EP-2101	-Tg>200℃ -Dk 3.8， Df 0.008 -High peeling strength -Good impact property
EP-2102	-Dk 3.8 -Df 0.01 -Tg>150℃ -Good toughness -Halogen-free system -High peeling strength

Epoxy binder for heat sink application

-High peeling strength

-Excellent heat
resistance

EP-4101	-UL 94 Vо -Tg 175℃ -Td 390℃ -Good heat resistance -High filler binding capacity (over 75%)
EP-4102	-Tg 165℃ -UL 94 Vo -Td 390℃ -Halogen-free resin -Good heat resistance -High filler binding capacity (over 75%)

Polyimide resins

-High Tg
-Heat resistance
-Inflaming retarding

PI-3101	-Tg>250℃ -UL94 V1 -Td 390℃ -Excellent heat resistance
PI-3102	-Tg>250℃ -UL94 V0 -Td 420℃ -Excellent heat resistance
PI-3103	-Td 390℃ -Tg >200℃ -Non-flow -Excellent heat resistance